Electronic Devices_Application

Electronic Devices

MOFPoly PCM—Upgraded plastic performance, excellent temperature control function
MOFPoly PCM—Empowering electronic devices with efficient heat dissipation and temperature control

MOFPoly PCM—Upgraded plastic performance, excellent temperature control function

The fluid with nano phase change microcapsules has fluidity and high energy storage capacity. It can be added to liquid cooling media, theoretically increasing the heat flux density of the coolant by four times under the same conditions. It can effectively increase the total heat exchange capacity, reduce pump power consumption, and decrease carbon emissions within a limited volume space. Used for liquid cooling in data centers, electric vehicles, energy storage batteries, spacecraft, and other scenarios.

Particle size less than 200nm: prevent wall hanging and settling; Does not affect the liquid flow velocity

High enthalpy value: fewer cycles/lower liquid flow rate; Better cooling performance

Elastic shell, no volatilization, no leakage: safer and more durable temperature control effect
MOFPoly PCM—Empowering electronic devices with efficient heat dissipation and temperature control

Solved the problems of low thermal conductivity and limited cycle times of traditional phase change materials, while overcoming the potential risks of fluorination treatment to the environment and health during the packaging process of traditional phase change materials. This product completely eliminates the risk of leakage and phase separation of liquid phase change materials, and has complete flame retardant properties, providing users with more stable and durable performance guarantees. We can provide customers with reliable and advanced energy storage and temperature control solutions in the fields of industrial and commercial energy storage, building energy conservation, cold chain logistics, and other areas.

For the first time globally, stable and mass-produced nano micro packaging technology has been achieved.

Particle size less than 200nm: prevent wall hanging and settling; Does not affect the liquid flow velocity

High enthalpy value: fewer cycles/lower liquid flow rate; Better cooling performance

Elastic shell, no volatilization, no leakage: safer and more durable temperature control effect

Application Cases

Thermal interface material

Microcapsulated PCM (MOFPloy PCM) applied in thermal interface materials can significantly enhance thermal management efficiency. When the temperature rises, the microcapsules absorb excess heat through melting, reducing interfacial thermal resistance. Conversely, when the temperature drops, the microcapsules release stored heat through solidification, maintaining a stable thermal environment. This unique property makes them highly valuable in applications such as electronic devices, batteries, and high-power equipment, particularly in scenarios requiring efficient heat dissipation and temperature control. Additionally, the microcapsule structure prevents leakage of the phase change material, ensuring long-term reliability and stability of the thermal interface material. By leveraging phase change microcapsules, thermal interface materials can achieve higher thermal conductivity, superior heat dissipation performance, and extended device lifespan.

UltraST PCM modules/sheets

UltraST PCM modules/sheets are primarily used in electronic devices for efficient thermal management, which absorbs and releases heat through a phase change process to effectively regulate device temperature in high-performance computing devices such as servers In Gpus and cpus, the PCM module can absorb excess heat generated during operation, prevent the chip from overheating, thereby improving the stability and reliability of the device. In addition, the PCM module/wafer can also be used in smartphones Base stations and other equipment, combined with materials such as thermal conductivity adhesive, further reduce thermal resistance, improve heat dissipation efficiency, and ensure that electronic equipment maintains good thermal performance during high load operation.

Mofpoly PCM thermal conductivity adhesive

The combination of Mofpoly PCM and thermal conductivity adhesive can give full play to the energy storage and temperature control characteristics of phase-change microcapsules and the efficient heat conduction performance of thermal conductivity adhesive. This composite material can quickly absorb and conduct heat, effectively reduce the heat generated during the operation of electronic devices, thereby improving its thermal safety and stability.

Thermal Management Scheme for Electronic Devices

Nano phase change microcapsules can help electronic devices effectively regulate temperature in high load, high temperature environments, and long-term operation, thereby improving their performance and extending their lifespan. By integrating these materials into the metal casing or internal structure of electronic devices, it can help absorb and disperse the generated heat, ensuring stable operation of the equipment within a suitable temperature range. In addition, under extreme temperature conditions such as high or low temperature environments, these phase change materials can also help electronic devices maintain stable operating temperatures and improve their environmental adaptability.

Application