Microencapsulation Technology

PASSIVE EDGE®  Nano Phase Change Material Microcapsules utilize advanced double-layer encapsulation technology to form leak-proof core-shell particles, with PCM fully enclosed in a durable shell. Featuring high encapsulation rate and high enthalpy, the product ensures no leakage, no formaldehyde, and stable performance. Widely applicable to textiles, electronic devices, and other thermal management scenarios, it provides efficient, safe, and sustainable temperature control solutions.