MOFPoly PCM_Microencapsulation Technology

MOFPoly PCM

Product Description

ASSIVE EDGE® NANO Microencapsulated Phase Change Materials (MOFPloy PCM) utilize cutting-edge MOFPoly microencapsulation technology to form leak-proof core-shell particles. The PCM is fully enclosed within a durable outer shell, ensuring reliability. This technology meets a wide range of thermal management application needs, including but not limited to liquid cooling, textiles, and temperature control solutions for electronic devices.

Applicable Scenarios

Spinning And Weaving

Liquid Cooling

Functional Plastics

Overfilling

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Product Model	Phase Change Temperature
MOFPloy PCM - 23	23℃	Download TDS Inquiry
MOFPloy PCM - 28	28℃	Download TDS Inquiry
MOFPloy PCM - 37	37℃	Download TDS Inquiry
MOFPloy PCM - 40	40℃	Download TDS Inquiry
MOFPloy PCM - 45	45℃	Download TDS Inquiry
MOFPloy PCM - 105	105℃	Download TDS Inquiry
MOFPloy PCM - 107	107℃	Download TDS Inquiry
MOFPloy PCM - 115	115℃	Download TDS Inquiry
Customized		Download TDS Inquiry

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Microencapsulation Technology

Microcapsule encapsulation technology

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About Us

Phase Change Materials Technology

Microencapsulation Technology

Application

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